- All sections
- H - Electricity
- H01Q - Antennas, i.e. radio aerials
- H01Q 5/42 - Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements using two or more imbricated arrays
Patent holdings for IPC class H01Q 5/42
Total number of patents in this class: 213
10-year publication summary
|
12
|
14
|
11
|
27
|
26
|
21
|
28
|
24
|
27
|
10
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| CommScope Technologies LLC | 4937 |
42 |
| Huawei Technologies Co., Ltd. | 100781 |
19 |
| Samsung Electronics Co., Ltd. | 131630 |
10 |
| Telefonaktiebolaget LM Ericsson (publ) | 26435 |
10 |
| Ericsson | 20417 |
7 |
| John Mezzalingua Associates, LLC | 256 |
7 |
| Murata Manufacturing Co., Ltd. | 22355 |
5 |
| Amazon Technologies, Inc. | 24422 |
5 |
| Qualcomm Incorporated | 76576 |
4 |
| Nokia Shanghai Bell Co., Ltd. | 1300 |
4 |
| Apple Inc. | 50209 |
3 |
| Raytheon Company | 8535 |
3 |
| Comba Telecom Technology (Guangzhou) Ltd. | 266 |
3 |
| Communication Components Antenna Inc. | 42 |
3 |
| Kymeta Corporation | 253 |
3 |
| Blue Digs LLC | 24 |
3 |
| Quintel Cayman Limited | 20 |
3 |
| Sony Corporation | 32931 |
2 |
| Intel Corporation | 45621 |
2 |
| Samsung Electro-mechanics Co., Ltd. | 4798 |
2 |
| Other owners | 73 |